
2025-08-11 07:53:39
Structural Completeness in bi-IPC
Rodrigo Nicolau Almeida, Nick Bezhanishvili
https://arxiv.org/abs/2508.05682 https://arxiv.org/pdf/2508.05682
Structural Completeness in bi-IPC
Rodrigo Nicolau Almeida, Nick Bezhanishvili
https://arxiv.org/abs/2508.05682 https://arxiv.org/pdf/2508.05682
ROS 2 Agnocast: Supporting Unsized Message Types for True Zero-Copy Publish/Subscribe IPC
Takahiro Ishikawa-Aso, Shinpei Kato
https://arxiv.org/abs/2506.16882
‘Worst-case scenario of famine’ now unfolding in Gaza: Global hunger monitoring system.
https://www.aljazeera.com/news/liveblog/2025/7/29/live-israel-kills-92-in-gaza-in-one-day-as-death-toll-nears-60000?updat…
@… wanted to sanity check something here.
The H7 series UFBGA176 25 package is 0.65mm pitch, 0.29mm diameter solder balls. Their recommended pad diameter is 0.3mm which is odd, per IPC I think you'd normally want an 0.25mm land.
But where things get weird is the 0.8mm TFBGA240 25. It's 0.4mm diameter balls, so I would expect 0.3mm lands but…
Ramping Up Open-Source RISC-V Cores: Assessing the Energy Efficiency of Superscalar, Out-of-Order Execution
Zexin Fu, Riccardo Tedeschi, Gianmarco Ottavi, Nils Wistoff, C\'esar Fuguet, Davide Rossi, Luca Benini
https://arxiv.org/abs/2505.24363
CrossPL: Evaluating Large Language Models on Cross Programming Language Code Generation
Zhanhang Xiong, Dongxia Wang, Yuekang Li, Xinyuan An, Wenhai Wang
https://arxiv.org/abs/2507.19904