For some reason the combination of 160K and my Mitutoyo 100x/0.90 objective means that as the last bits of ILD begin to etch away, substrate features become *less* visible.
I expected to see strong contrast at edges of substrate features when the ILD was etched away despite poly, STI trenches, and diffusion areas all being the same material (silicon).
But that's not what I'm seeing.
Going back to my archives, though, most of my good full die 100x shots are with the …
Fine-grained dark matter substructure and axion haloscopes
Ciaran A. J. O'Hare, Giovanni Pierobon
https://arxiv.org/abs/2509.14874 https://arxiv.org/pd…
Proposal of cavity quantum acoustodynamics platform based on Lithium Niobate-on-Sapphire chip
Xin-Biao Xu, Lintao Xiao, Bo Zhang, Weiting Wang, Jia-Qi Wang, Yu Zeng, Yuan-Hao Yang, Bao-Zhen Wang, Xiaoxuan Pan, Guang-Can Guo, Luyan Sun, Chang-Ling Zou
https://arxiv.org/abs/2509.14728
PIC12F683 just has a few traces of dielectric and a few vias left before it's fully stripped to substrate.
Surprisingly, poly still seems fully intact. I'm not sure if any of my cleaning steps at the end will remove it, but it's quite firmly stuck down and I haven't seen *any* of it floating free yet. Some of the tungsten contacts have come off, which doesn't surprise me at all.
Now that all the oxide over the poly is gone the poly images are even sharper, alt…
Zero-energy resonances in ultracold hydrogen sticking to liquid helium films of finite thickness
R. Karahanyan, A. Voronin, V. Nesvizhevsky, A. Semakin, S. Vasiliev
https://arxiv.org/abs/2509.14652
PIC12F683 poly/substrate with some residual contacts (some floated away, some sitting at random positions, some still firmly attached) but almost all oxide etched.
Doing the whole die at this state, then will probably do a clean to get all the loose contacts and debris off, another imaging pass.
Then I'm not sure if it's worth the effort to try for a clean substrate image given the poor contrast I'm seeing, vs just calling this the final form. We'll see what happe…
And now that I'm below poly, I think it's time to give my microscope a well-deserved break from the near-constant imaging it's been doing the past few weeks.
369963 photos totaling 203.4 GB. Over a hundred hours of imaging time averaging around 3000 photos an hour. 27 etch cycles, 72 imaging runs.
I'll start shooting some analysis video later today talking about the device floorplan and such. But as a teaser, here's the final image just after stripping poly bu…
Multiplicity Distributions and the Frontier between Soft and Hard Physics
H. R. Martins-Fontes, F. S. Navarra
https://arxiv.org/abs/2509.15056 https://arxi…
Gluon Polarimetry with Energy-Energy Correlators
Yu-Kun Song, Shu-Yi Wei, Lei Yang, Jian Zhou
https://arxiv.org/abs/2509.14960 https://arxiv.org/pdf/2509.1…
And another couple of etch cycles on the PIC12F683 done.
On the home stretch, I've almost got the last of the dielectric off. But I don't want to be too aggressive because ideally I'd get a beauty shot of intact poly across the whole die first, *then* undercut the poly and get a substrate image.
So I'm still doing my usual 2 minutes etch, then image routine. It'll take as long as it takes.