Tootfinder

#CoWoS, or Chip-on-Wafer-on-Substrate,
is one of TSMC’s most advanced ways of packaging chips.
It allows several chips to work closely together as one,
making the whole system faster and more efficient while using less energy.

Why this key chip technology is crucial to the AI race between the US and China
In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company (TSMC), the world’s “most powerful company” according to US President Donald Trump, unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.