Tootfinder

#CoWoS, or Chip-on-Wafer-on-Substrate,
is one of TSMC’s most advanced ways of packaging chips.
It allows several chips to work closely together as one,
making the whole system faster and more efficient while using less energy.

Why this key chip technology is crucial to the AI race between the US and China
In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company (TSMC), the world’s “most powerful company” according to US President Donald Trump, unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.

Just spent a while playing with #void #linux in a VM for a few hours; it's curious - it feels quite old school; it's got an installer but it's fairly basic; it's got it's own packaging system which seems to work OK; and have Wayland running on it (using labwc)
(I ended up using …

Snaps: Bloated and Outdated?
Jukka Ruohonen, Qusai Ramadan
https://arxiv.org/abs/2507.00786 https://arxiv.org/pdf/2507.00786

Snaps: Bloated and Outdated?
Snap is an alternative software packaging system developed by Canonical and provided by default in the Ubuntu Linux distribution. Given the heterogeneity of various Linux distributions and their various releases, Snap allows an interoperable delivery of software directly to users. However, concerns and criticism have also been frequently expressed. Regarding this criticism, the paper shows that currently distributed snap packages are indeed on average bloated in terms of their sizes and outdate…

This https://arxiv.org/abs/2410.21844 has been replaced.
initial toot: https://mastoxiv.page/@arXiv_mat…

Optimizing Perishable and Non-Perishable Product Assignment to Packaging Lines in a Sustainable Manufacturing System: An AUGMECON2VIKOR Algorithm
Identifying appropriate manufacturing systems for products can be considered a pivotal manufacturing task contributing to the optimization of operational and planning activities. It has gained importance in the food industry due to the distinct constraints and considerations posed by perishable and non-perishable items in this problem. Hence, this study proposes a new mathematical model according to knowledge discovery as well as an assignment model to optimize manufacturing systems for perisha…

Versatile Lithium Niobate Platform for Photoacoustic/Thermoelastic Gas Sensing and Photodetection
Haoyang Lin, Wenguo Zhu, Yongchun Zhong, Huihui Lu, Jianhui Yu, Huadan Zheng
https://arxiv.org/abs/2505.24276

Versatile Lithium Niobate Platform for Photoacoustic/Thermoelastic Gas Sensing and Photodetection
We present a lithium niobate multi-functional platform (LN-MFP) that integrates photoacoustic and thermoelastic spectroscopy with photodetection on a single chip. Utilizing LN's piezoelectric and thermoelastic properties and an optimized design, it achieves high sensitivity across visible to long-wave infrared wavelengths. We demonstrate photoacoustic/thermoelastic gas sensing and photodetection using LN-MFP. The compact, integrated system with custom packaging and direct wire bonding reduces c…

This https://arxiv.org/abs/2410.21844 has been replaced.
initial toot: https://mastoxiv.page/@arXiv_mat…

Optimizing Perishable and Non-Perishable Product Assignment to Packaging Lines in a Sustainable Manufacturing System: An AUGMECON2VIKOR Algorithm
Identifying appropriate manufacturing systems for products can be considered a pivotal manufacturing task contributing to the optimization of operational and planning activities. It has gained importance in the food industry due to the distinct constraints and considerations posed by perishable and non-perishable items in this problem. Hence, this study proposes a new mathematical model according to knowledge discovery as well as an assignment model to optimize manufacturing systems for perisha…